• Long Pause-to-Print Capabilities
• Excellent Wetting. Even Leadless Devices
• Enhances Fine Print Definitions
• Exceptional Reflow During Long, Hot Profiles
• ROL0 per IPC J-STD-004
• Reduced Voiding

RMA258-15R rosin based solder paste has been developed for assemblers of high reliability and military electronics. RMA258- 15R offer long pause-to-print capabilities even on miniaturized devices. RMA258-15R reduces voiding on BGA/BTC and eliminates head-in-pillow defects. Powerful activators in RMA258- 15R produce bright, smooth and shiny solder joints. RMA258-15R is capable of withstanding long hot reflow profiles common to high mass assemblies such as backplanes and power management. RMA258-15R residues have been formulated for removal in vapor degreaser, solvent and saponifed wash systems.